Manufacturer PCB Printed Circult Board Motherboard Price for Mobile Phones

• Model NO.: MD-06
• Processing Technology: Electrolytic Foil
• Base Material: Fr4
• Insulation Materials: Epoxy Resin
• Brand: Midou
• Delivery Time: Within Fatest 48 Hours
• Using Application: Mobile Phones ,Motor ,TV ,Laptops
• Material Base: Aluminum or Copper or Fr4
• Quality Level: High Quality
• Factory or Trader: Experienced Factory
• Support Custom Making OEM: Support OEM Custom Making
• Transport Package: Carton
• Specification: 2 M length, 5G model special using, custom size
• Trademark: MIDOU
• Origin: China
• Production Capacity: 18000

Product Description

Conventional FR-4/NormalTg
(Feature)
•   UVB and AOI (automatic optical inspection)
compatible
•   Excellent dimensional stability
•   Excellent heat resistance and mechanical
properties
•  IPC-4101E/21 specification is applicable
Laminate Properties
Test Item		Test Method	Test Condition		Unit	Specification	Typical Value
		(IPC-TM- 650)				(IPC-4101E/21)
	Thermal Stress	2.4.13.1	Float 288 ºC/ Unetched		Sec	≥10	≥180
	Glass Transition (Tg)	2.4.25	E-2/105  DSC		ºC	≥130	135
	CTE/ Z-Axis Expansion		Alpha 1		ppm/ºC	--	60
		2.4.24	Alpha 2			--	300
Thermal			50 - 260 ºC		%	--	4.3
	T-260	2.4.24.1	TMA		min	--	>10
	TD(5% weight loss)	2.4.24.6	TGA		ºC	--	305
	Flammability	UL94	E-24/ 23		Rating	V-0	V-0
	Surface Resistivity	2.5.17.1	C-96/35/90		MΩ	≥104	1.0×106
	Volume Resistivity	2.5.17.1	C-96/35/90		MΩ-cm	≥106	1.0×108
	Dielectric Breakdown	2.5.6	D-48/ 50+D-0.5/ 23		kV	≥40	69
	Dielectric Constant	2.5.5.2	Etched  (RC50%)	@ 1 MHz		≤5.4	4.35
				@ 1 GHz	-		4.25
Electrical	Loss Tangent	2.5.5.2	Etched  (RC50%)	@ 1 MHz		≤0.035	0.017
				@ 1 GHz	-		0.018
	CTI	IEC60112	A		V	--	≥175
	Arc Resistance	2.5.1	D-48/ 50+D-0.5/ 23		Sec	≥60	125
			125 ºC			≥0.70	1.7
	Peel Strength (1 oz.)	2.4.8	Float 288 ºC/ 10 Sec		N/mm	≥1.05	1.75
			After Process Solution			≥0.80	1.3
Mechanical	Flexural Strength	2.4.4	Length Direction		N/mm2	≥415	565
			Cross Direction			≥345	446
	Moisture Absorption	2.6.2.1	D-24/23		%	≤0.5	0.19
Remarks:
- Typical Values for reference only.
- Standard Values according to IPC-4101E/ 21
- Typical Value of Specimen thickness  is 1.6mm (8*7628)
Technical Specification
Laminate List
Thickness		Size				Copper foil Type
0.05-3.20		37"×49" ,41"×49" ,43"×49" 74"×49" ,82"×49" ,86"×49"				Reverse treated copper foil
						RTF: 1/3OZ-3OZ
						HTE copper foil
						HTE: 1/3OZ-3OZ
Prepreg List
UL Designation	PP style	R/C(%)		Dk±0.2(1GHz)		Df±10%(1GHz)	Thickness(mil)
		61±2		3.8		0.018	2.8±0.3
	1080	63±2		3.8		0.019	3.0±0.4
		65±2		3.7		0.019	3.2±0.4
	3313	50±2		4		0.018	3.6±0.5
		55±2		3.9		0.018	3.9±0.5
		50±2		4.2		0.017	4.6±0.5
	2116	53±2		4.1		0.019	5.0±0.5
		55±2		4.1		0.019	5.3±0.5
	1506	43±3		4.5		0.016	6.0±0.5
		45±3		4.4		0.016	6.4±0.5
		44±3		4.5		0.015	7.9±0.8
	7628	46±3		4.5		0.016	8.2±0.6
		49±3		4.4		0.016	8.9±0.6
	7630	49±3		4.5		0.016	9.5±0.8
		50±3		4.5		0.016	9.8±0.8
Prepreg Storage
Condition						Shelf Life
Max. 50%RH & Max. 23ºC						90 days
Max. 5ºC(Normal in room temperature for at least 4h before using)						180 days