Manufacturing Electric Board Circuit LED PCB Board Price PCB Assembly Near Me

• Structure: Multilayer Rigid PCB
• Dielectric: FR-4
• Material: Polyester Glass Fiber Mat Laminate
• Model NO.: MD-01S
• Application: Aerospace
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Aluminum
• Insulation Materials: Organic Resin
• Brand: Midou
• Transport Package: Carton
• Specification: Double sided, 5 G using
• Trademark: MIDOU
• Origin: China
• Production Capacity: 18000

Product Description

Technical
Items		Mass	Sample
Layers		2~68L	120L
Max. Board Thickness		10mm(394mil)	14mm(551mil)
Min. Width	Inner   Layer	2.2mil/2.2mil	2.0mil/2.0mil
	Outer Layer	2.5/2.5mil	2.2/2.2mil
Registration	Same   Core	±25um	±20um
	Layer to Layer	±5mil	±4mil
Max. Copper Thickness		6Oz	30Oz
Min. Drill Hole Dlameter	Mechanical	≥0.15mm(6mil)	≥0.1mm(4mil)
	Laser	0.1mm(4mil)	0.050mm(2mil)
Max. Size (Finish Size)	Line-card	850mmX570mm	1000mmX600mm
	Backplane	1250mmX570mm	1320mmX600mm
Aspect Ratio (Finish Hole)	Line-card	20:01	28:01:00
	Backplane	25:01:00	35:01:00
Material	FR4	EM827, 370HR, S1000-2, IT180A, EM825, IT158,   S1000 / S1155, R1566W, EM285, TU862HF
	High Speed	Megtron6, Megtron4, Megtron7,TU872SLK,   FR408HR,N4000-13 Series,MW4000,MW2000,TU933
	High Frequency	Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835,   CLTE, Genclad, RF35, FastRise27
	Others	Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega   , ZBC2000,
Surface Finish		HASK, ENIG, Immersion Tin, OSP, Immersion   Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG