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Copper Clad Laminate Material PCB Board, PCB Copper Material Manufacturer

Product Details
Type: Copper Clad Laminate Materia
Dielectric: FR-4
Material: Fr4
  • Copper Clad Laminate Material PCB Board, PCB Copper Material Manufacturer
  • Copper Clad Laminate Material PCB Board, PCB Copper Material Manufacturer
  • Copper Clad Laminate Material PCB Board, PCB Copper Material Manufacturer
  • Copper Clad Laminate Material PCB Board, PCB Copper Material Manufacturer
  • Copper Clad Laminate Material PCB Board, PCB Copper Material Manufacturer
  • Copper Clad Laminate Material PCB Board, PCB Copper Material Manufacturer
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Basic Info.

Model NO.
MD-06S
Base Material
Fr4
Insulation Materials
Organic Resin
Model
Fr4
Brand
Midou
Delivery Time
Within Fatest 48 Hours
Quality
High Level
Support Custom Making
Yes, OEM Support
Factory Yes or No
Yes, PCB Board Manufacturer
Transport Package
Carton
Specification
20*20mm
Trademark
MIDOU
Origin
China
Production Capacity
150000 Square Meter

Product Description

Copper Clad Laminate Material PCB Board ,PCB copper material Manufacturer 


Why choose us  ? 

- Beacause we are real PCB manufactuer
supply motherboard and chips for
Laptops , Mobile phones , Motor , Cars , Earphones , Drones , Smart Watches , Wearable devices ,light power , cctv , medical equipment etc . 

-
We Offer High quality PCB board Material

 CCL / Copper Clab Laminate Material for PCB board Maker making , We also offer Alumninum Substrate  material for PCB board maker in high competitive price and High quality  


- We support custom PCB board making OEM
for any electronic area ,such like 2 M lengh pcb board or over size pcb board for large equipment 


- 48 Hours fastest delivery time 


Engineering capability 
 

Line width&space for outer layer/,

3.5 mil/ 3.5 mil

Copper thickness for PTH holes/

IPC class II&III/ IPC-2,3

Copper thickness for blind holes

IPC class II&III/ IPC-2,3

BGA PAD

min 0.2mm

Color of solder mask/

(Matt) Green/ ,

Thickness of solder mask/

Corner≥5um/5um

Surface finishing and thickness/

ENIG/:0.05-0.1um OSP:0.2-0.6um Immersion Tin/:≥0.8um Immersion Silver/:0.15-0.45um Hasl&Hasl LF:1-40um

Hole tolerance/

PTH:±3mil NPTH:±2mil

Dimension tolerance/

±0.1mm

Impedance control/

±10%

POFV/+

Depression≤25um/25um

Laser via copper filling/

Depression≤15um/:≤15um

Via in pad/

0.2-0.6mm







Using Application  : 







 

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