Type: | Copper Clad Laminate Materia |
---|---|
Dielectric: | FR-4 |
Material: | Fr4 |
Line width&space for outer layer/, |
3.5 mil/ 3.5 mil |
Copper thickness for PTH holes/ |
IPC class II&III/ IPC-2,3 |
Copper thickness for blind holes |
IPC class II&III/ IPC-2,3 |
BGA PAD |
min 0.2mm |
Color of solder mask/ |
(Matt) Green/ , |
Thickness of solder mask/ |
Corner≥5um/≥5um |
Surface finishing and thickness/ |
ENIG/:0.05-0.1umOSP:0.2-0.6umImmersion Tin/:≥0.8umImmersion Silver/:0.15-0.45umHasl&Hasl LF:1-40um |
Hole tolerance/ |
PTH:±3milNPTH:±2mil |
Dimension tolerance/ |
±0.1mm |
Impedance control/ |
±10% |
POFV/+ |
Depression≤25um/≤25um |
Laser via copper filling/ |
Depression≤15um/:≤15um |
Via in pad/ |
0.2-0.6mm |