Basic Info.
Processing Technology
Electrolytic Foil
Insulation Materials
Organic Resin
Production Capacity
15000 Square Meter
Product Description
Technical
Items
Mass
Sample
Layers
2~68L
120L
Max. Board Thickness
10mm(394mil)
14mm(551mil)
Min. Width
Inner Layer
2.2mil/2.2mil
2.0mil/2.0mil
Outer Layer
2.5/2.5mil
2.2/2.2mil
Registration
Same Core
±25um
±20um
Layer to Layer
±5mil
±4mil
Max. Copper Thickness
6Oz
30Oz
Min. Drill Hole Dlameter
Mechanical
≥0.15mm(6mil)
≥0.1mm(4mil)
Laser
0.1mm(4mil)
0.050mm(2mil)
Max. Size (Finish Size)
Line-card
850mmX570mm
1000mmX600mm
Backplane
1250mmX570mm
1320mmX600mm
Aspect Ratio (Finish Hole)
Line-card
20:01
28:01:00
Backplane
25:01:00
35:01:00
Material
FR4
EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF
High Speed
Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933
High Frequency
Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27
Others
Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,
Surface Finish
HASK, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG
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